An Introduction to Thermo-Compression Bonding Process

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The Thermo-compression bonding process helps to join an ultra-fine wire with another ultra-fine wire. This process is useful to join similar wires as well as even if both the wires are different in diameter and material. Using this technology, an ultra-fine wire can be connected with another wire that is 12 times thicker in diameter.

Welding and soldering methods were two traditional methods for joining the wires through melting together and applying a metal with a lower melting point, respectively. The Thermo-compression bonding process is a micro-soldering process that helps to connect ultra-fine wires of 9 microns that is five to ten times thinner compared to human hair.

As the demand for the microscopic parts in the components such as transducers and sensors is increasing, the demand for micro-coils using ultra-fine wires is increasing. In order to build the components such as sensors or transducers, manufacturers need to have effective technologies that are able to connect ultra-fine wires and overcome the constraints that the traditional soldering and welding methods used to face. The ultra-fine wires are required to wind the micro-coils that are essential for the manufacturing of the state-of-the-art micro-motion controlling and positioning systems.

However, there are several challenges associated with the connection process of ultra-fine wires. The major challenge for the development of ultra-fine wire connections is that there is a long list of environmental and physical factors that create constraints for the final shape and size of the components. Above all, in order to become usable for different applications, the components should follow the requirements for ultra-strict tolerance limits. Due to several important drawbacks, we can not depend on the traditional methods for joining ultra-fine wires.

Thermo-Compression Bonding Connections:

Thermo-compression bonding process-
i) helps to develop a connection between miniature thermocouples and ultra-fine wires,
ii) using the thicker intermediate wires develops metal-to-metal connections for a printed circuit board and micro-coils.
iii) connects a support system with micro-coils using metal-plated terminals.

Thermo-compression binding process is useful to prepare strain-free, corrosion-free, and highly durable connections. This process helps to reduce the manufacturing costs as this process is economical compared to the traditional processes. This thermo-pressure bonding process is not only able to integrate into mass-production but also effective to maintain high standards that are necessary for medical applications. Therefore, to manufacture disposal as well as long-life products such as permanent implants, this process is useful.

Advantages of Thermo-Compression Bonding Technology:

Thermo-compression bonding process provides several advantages such as-
i) This process helps to diminish the levels of noise.
ii) It helps to relieve strain at the connections.
iii) This bonding process eliminates the risk of damaging sensitive components. Thus, it is a safer process in comparison to the traditional processes.
iv) This thermal bonding process provides oxidation-free, durable connections.
v) This boding process helps to lessen the production costs using the mass-production facility.
vi) Automated manufacturing process of thermo-compression bonding technology helps to reduce human errors.

Traditional Methods:

Traditionally, there were two popular methods for joining wires such as-
i) soldering method that applies a filler metal and an external heat source to fill the joints.
ii) welding method that applies an electric current and helps to join two metals through melting them.

Besides physical constraints, these methods are not suitable to connect ultra-fine wires for several drawbacks such as-

  • These methods can result in the oxidation of wires and harm the durability of the wires.
  • Traditional methods can destroy the wires through imprecise heat spreading.
  • These methods can develop excess physical strain and thus, the durability and reliability of the connections will be affected.


Thermo-compression bonding technology has several applications such as-

  • In therapeutic applications to prepare the devices for electricity-based ablations and electrophysiology treatments.
  • To manufacture active implants such as pace-makers, pain management devices and to control and monitor deep brain stimulations.
  • In order to detect physiological conditions such as heart-beat, blood flow, blood pressure, respiration and to conduct wireless communication in miniature sensor implants.
  • In dental and orthopedic treatments using pulse electromagnets.
  • To manufacture the orientation and navigation sensors for the applications of targeted drug delivery, stent positioning, targeted radiation catheters, endoscopic manipulation, highly accurate ablations, implanted markers, etc.

Apart from these applications, thermo-compression bonding technology allows manufacturers to consider new possibilities to develop miniaturized medical devices.


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