What is Micro Soldering Method?

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Micro soldering is a method of joining two ultra-fine wires that can have a diameter as small as 9 microns. In comparison to the diameter of a human hair, the ultra-fine wire’s diameter is five to ten times thinner. There were two traditional methods for joining two similar or different wires such as i) the welding method and ii) the soldering method. However, these methods are not effective to join ultra-fine wires.

The demand for sensors, transducers, and other miniaturized and microscopic components for medical devices is increasing tremendously in today’s world.  However, the development of these components involves the joining of ultra-fine wires. It is also essential to have an effective joining method that can overcome the drawbacks of traditional welding and soldering methods. Ultra-fine wires are useful to wind coils through the use of state-of-the-art micro-motion positioning and control systems.

As there are several environmental and physical factors that create limitations for the final shape and size of the components, manufacturers face non-trivial challenges to join the ultra-fine wires. On the other hand, the final component should be able to satisfy the ultra-strict tolerance requirements. For these reasons, manufacturers can not rely on the traditional methods to connect ultra-fine wires.

About Traditional Methods:

The traditional methods to join wires are-
i) Soldering Method: This method involves a filler metal with a lower melting point and the application of an external heat source in order to make a joint between the wires.
ii) Welding Method: This method uses the application of an electric current to melt the metals to get joined.

These methods are not effective for the physical constraints. On the other hand, there are several drawbacks associated with these methods such as-

  • These methods can cause oxidation around the wires and can affect the durability of the wires.
  • The imprecise heat spread through these methods can cause the destruction of the wires.
  • The heat-based soldering methods can result in an excess physical strain that harms the reliability and durability of the connections.

Thermo-Pressure Bonding Technology and the Connections:

The ultimate solution for the drawbacks of traditional methods and to overcome the connectivity challenges is the innovative thermo-pressure bonding technology. This technology not only helps to join ultra-fine wires of similar diameters and metals but also can connect a wire with another twelve times thicker wire. You can effectively use this technology to join two different types of metals.

Thermo-pressure bonding technology is effective

  • To connect ultra-fine wires with miniature thermo-couples.
  • To provide metal-to-metal connections between a printed circuit board and a micro-coil with the help of a thicker intermediate wire.
  • To connect a support system with a micro-coil using a metal-plated terminal.

The thermo-pressure bonding technology not only offers molecular connections but also provides corrosion-free, strain-free, and highly durable and reliable joints. In comparison to the traditional soldering and welding methods, this method is economical which lessens the overall manufacturing costs. After implementing this technology for several production processes and a variety of customer environments, it has been found that this technology is effective for the integration into mass production processes and able to meet high standards that are essential for medical applications. In order to build the disposal and long-life products, for instance, permanent implants, this technology is useful.


Micro-coils and ultra-fine wire connectivity technology are useful for a variety of applications such as

  • Therapeutic Applications: In order to manufacture the devices for electrophysiology treatments and electricity-based ablations,
  • Active Implants: To prepare the components of pain management devices, deep brain stimulation, and implanted pace-makers and to monitor and control the devices,
  • Diagnostics: In the case of detecting physiological conditions such as heartbeat or blood pressure and measuring blood flow and respiration where miniature sensor implants conduct wireless communication,
  • Navigation: In order to prepare the navigation and orientation sensors that offers several functions such as targeted drug delivery, endoscopic manipulation, stent positioning, targeted radiation catheters, implanted markers, and highly accurate ablations,
  • Orthopedic: Using the pulse electromagnets, micro-coils help in orthopedic and dental treatments.

The Future:

Ultra-fine wire technologies have opened the door for limitless new possibilities. On the other hand, the demand for accessing high-density body regions without affecting the functions of the body is increasing. These technologies also help to increase the life span of the implants as well as diminish energy consumptions.  Therefore, there is a great future ahead for ultra-fine connectivity technology.


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